Cover Letter_Model Declaration Letter

File Info : application/pdf, 1 Pages, 179.33KB

Array
(
    [0] => Array
        (
            [url_sha] => 73a6a95e1d4991e99807bd6c2bdaa6b269cf7d65e9cd4cfac57c1fd37450cc13
            [source] => fccid
            [url] => https://apps.fcc.gov/eas/GetApplicationAttachment.html?id=7793998
            [href_text] => Cover Letter_Model Declaration Letter
            [href_description] => Microchip Technology Inc. WBZ451 Wireless Module 2ADHKWBZ451 2ADHKWBZ451 wbz451
            [http_status] => 200
            [http_lastmod] => 0000-00-00 00:00:00
            [http_contenttype] => application/pdf
            [http_filename] => GetApplicationAttachment.html?id=7793998
            [http_size] => 183633
            [file_sha256] => 91fadf4e7be9907b7d7b8d62551847545756a6cb8744fa279cd493d4f55a307a
            [domain] => document.fccid
        )

)

Array
(
    [0] => Array
        (
            [id] => 7793998
            [file_sha256] => 
            [applicationId] => in59Se+WR/KCW4nQgL1YYQ==
            [description] => Cover Letter_Model Declaration Letter
            [shortTermConfidential] => No
            [permanentConfidential] => No
            [supercede] => No
            [exhibitType] => External Photos
            [fileType] => Adobe Acrobat PDF
            [displayType] => pdf
            [fileSize] => 183635
            [submissionDate] => 2024-11-04 00:00:00
            [dateAvailable] => 2024-11-04 00:00:00
            [creationDate] => 
            [producer] => 
            [modDate] => 
            [title] => 
            [creator] => 
            [author] => 
            [pages] => 
            [realSize] => 
            [html] => 0
            [png] => 0
            [txt] => 0
            [version] => 0
            [source] => 0
            [fccId] => 2ADHKWBZ451
            [cleanFccId] => 2ADHKWBZ451
            [exif] => 0
        )

)