J9C-M2X72_cvrltr_FCC POA_QTI
tags: Array
(
[0] => Array
(
[url_sha] => df77006a5404e6bb1e505fa3809526c70bc5e59861918ae3c4731f8e40cb6a8e
[source] => fccid
[url] => https://apps.fcc.gov/eas/GetApplicationAttachment.html?id=7556711
[href_text] => J9C-M2X72_cvrltr_FCC POA_QTI
[href_description] => Qualcomm Technologies, Inc. M2X72 J9C-M2X72 J9CM2X72 m2x72
[http_status] => 200
[http_lastmod] => 0000-00-00 00:00:00
[http_contenttype] => application/pdf
[http_filename] => GetApplicationAttachment.html?id=7556711
[http_size] => 107811
[file_sha256] => fe7cd64c8d6b77380160c79cf76aa3c538eaca4123b7f587bbfd8b3f59f0b389
[domain] => document.fccid
)
[1] => Array
(
[url_sha] => 72bf0673fcd5eb2b69bbf2418d1969165b94d95591971ce7516c7308807e53a8
[source] => fccid
[url] => https://apps.fcc.gov/eas/GetApplicationAttachment.html?id=7556591
[href_text] => J9C-M2X72_cvrltr_FCC POA_QTI
[href_description] => Qualcomm Technologies, Inc. M2X72 J9C-M2X72 J9CM2X72 m2x72
[http_status] => 200
[http_lastmod] => 0000-00-00 00:00:00
[http_contenttype] => application/pdf
[http_filename] => GetApplicationAttachment.html?id=7556591
[http_size] => 107811
[file_sha256] => fe7cd64c8d6b77380160c79cf76aa3c538eaca4123b7f587bbfd8b3f59f0b389
[domain] => document.fccid
)
)
Array
(
[0] => Array
(
[id] => 7556591
[file_sha256] =>
[applicationId] => hn/aF75MrajAHLIYt/W+dA==
[description] => J9C-M2X72_cvrltr_FCC POA_QTI
[shortTermConfidential] => No
[permanentConfidential] => No
[supercede] => No
[exhibitType] => Cover Letter(s)
[fileType] => Adobe Acrobat PDF
[displayType] => pdf
[fileSize] => 107813
[submissionDate] => 2024-08-12 00:00:00
[dateAvailable] => 2024-08-14 00:00:00
[creationDate] =>
[producer] =>
[modDate] =>
[title] =>
[creator] =>
[author] =>
[pages] =>
[realSize] =>
[html] => 0
[png] => 0
[txt] => 0
[version] => 0
[source] => 0
[fccId] => J9C-M2X72
[cleanFccId] => J9CM2X72
[exif] => 0
)
)