Cover Letter

File Info : application/pdf, 1 Pages, 75.48KB

Array
(
    [0] => Array
        (
            [url_sha] => 4ed56f8e7789425ad66b42c7f62f1c904749e4e8cfef5089c847dcaa2b8e84ba
            [source] => fccid
            [url] => https://apps.fcc.gov/eas/GetApplicationAttachment.html?id=6648662
            [href_text] => Cover Letter
            [href_description] => SIMCom Wireless Solutions Limited 8XM0001 4G Module 2AJYU-8XM0001 2AJYU8XM0001 8xm0001
            [http_status] => 200
            [http_lastmod] => 0000-00-00 00:00:00
            [http_contenttype] => application/pdf
            [http_filename] => GetApplicationAttachment.html?id=6648662
            [http_size] => 77289
            [file_sha256] => db69a8d8e86a78c3e32f0c483171a994e89f8d9a3bf6ba89a5db2af6cd99e1e0
            [domain] => document.fccid
        )

)

Array
(
    [0] => Array
        (
            [id] => 6648662
            [file_sha256] => 
            [applicationId] => A+S7KETQ2G8h9/hH6K3vHQ==
            [description] => Cover Letter
            [shortTermConfidential] => No
            [permanentConfidential] => No
            [supercede] => No
            [exhibitType] => Cover Letter(s)
            [fileType] => Adobe Acrobat PDF
            [displayType] => pdf
            [fileSize] => 147488
            [submissionDate] => 2023-07-07 00:00:00
            [dateAvailable] => 2023-07-07 00:00:00
            [creationDate] => 
            [producer] => 
            [modDate] => 
            [title] => 
            [creator] => 
            [author] => 
            [pages] => 
            [realSize] => 
            [html] => 0
            [png] => 0
            [txt] => 0
            [version] => 0
            [source] => 0
            [fccId] => 2AJYU-8XM0001
            [cleanFccId] => 2AJYU8XM0001
            [exif] => 0
        )

)