This document is an approval sheet for the RFECA3216060A1T ceramic antenna manufactured by Walsin Technology Corporation. It details the antenna's specifications, features, and reliability test results. The antenna is RoHS compliant and halogen-free, operating in the 2.4 GHz ISM band.
Key features include its small size (3.2 x 1.6 x 0.6 mm³), LTCC process, high stability in temperature and humidity, and superb performance when placed on the PCB edge. It is designed for ISM band 2.4GHz and Bluetooth applications.
The document provides detailed dimensions, solder land pattern design, and electronic characteristics, including working frequency range, gain, VSWR, polarization, and impedance. It also includes radiation pattern data and reliability test results, covering solderability, leaching resistance, resistance to soldering heat, drop test, vibration, and adhesive strength. The document also outlines soldering conditions and packaging details.
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[title] => Walsin RFECA3216060A1T Ceramic Antenna Approval Sheet
[description] => Explore the RFECA3216060A1T ceramic antenna specifications, including features, dimensions, performance, and reliability testing.
[brand_name] => Walsin Technology Corporation
[keywords] => ["RFECA Series", "RFECA3216060A1T", "Ceramic Antenna", "RoHS Compliance", "Halogens Free"]
[intro] =>
This document is an approval sheet for the RFECA3216060A1T ceramic antenna manufactured by Walsin Technology Corporation. It details the antenna's specifications, features, and reliability test results. The antenna is RoHS compliant and halogen-free, operating in the 2.4 GHz ISM band.
Key features include its small size (3.2 x 1.6 x 0.6 mm³), LTCC process, high stability in temperature and humidity, and superb performance when placed on the PCB edge. It is designed for ISM band 2.4GHz and Bluetooth applications.
The document provides detailed dimensions, solder land pattern design, and electronic characteristics, including working frequency range, gain, VSWR, polarization, and impedance. It also includes radiation pattern data and reliability test results, covering solderability, leaching resistance, resistance to soldering heat, drop test, vibration, and adhesive strength. The document also outlines soldering conditions and packaging details.
)