Microchip Technology Modular Approval Request Letter

Modular approval Request letter

This document outlines the modular approval request for a wireless module manufactured by Microchip Technology Inc. The request adheres to Section 15.212 of the FCC regulations, detailing compliance with requirements for modular transmitters. The module features RF shielding, buffered modulation/data inputs, and its own power supply regulation to ensure compliance under various operating conditions.

The document confirms that the module complies with provisions for external power amplifiers and antennas, and has been tested in a stand-alone configuration. It also addresses labeling requirements and compliance with RF exposure limits as per FCC Sections 1.1310 and 2.1093. The modular transmitter complies with all specific rules and operating requirements that ordinarily apply to a complete transmitter. Instructions are provided to the OEM on how to label the end product.

The document is signed by HRUSHIKESH VASUKI, Vice President, Business Unit General Manager, Wireless Solutions Group, Microchip Technology Inc.


File Info : application/pdf, 2 Pages, 204.30KB

Download
Microsoft Word for Microsoft 365
tags: ["2ADHKATA8510M", "Modular Approval", "Wireless Module", "FCC Compliance", "RF Shielding", "Power Regulation", "Antenna Compliance", "Labeling Requirements"]
Array
(
    [0] => Array
        (
            [url_sha] => dcefa048f812eb5c51e2933b1362568dd2efa525ada30130a3e5c2ec001b3f21
            [source] => fccid
            [url] => https://apps.fcc.gov/eas/GetApplicationAttachment.html?id=8307568
            [href_text] => Modular approval Request letter
            [href_description] => Microchip Technology Inc. ATA8510M ATA8510M 2ADHKATA8510M 2ADHKATA8510M ata8510m
            [http_status] => 200
            [http_lastmod] => 0000-00-00 00:00:00
            [http_contenttype] => 
            [http_filename] => GetApplicationAttachment.html?id=8307568
            [http_size] => 209206
            [file_sha256] => d7448b92b1d5e246f413d7e1767f0ac41236bc9b9333d62b9a82ee276646d786
            [domain] => document.fccid
        )

)
Array
(
    [file_sha256] => d7448b92b1d5e246f413d7e1767f0ac41236bc9b9333d62b9a82ee276646d786
    [cleanFccId] => 2ADHKATA8510M
    [title] => Microchip Technology Modular Approval Request Letter
    [description] => Modular approval request letter for Microchip Technology Inc. wireless module. Compliance with FCC regulations and standards is detailed.
    [brand_name] => Microchip Technology Inc.
    [keywords] => ["2ADHKATA8510M", "Modular Approval", "Wireless Module", "FCC Compliance", "RF Shielding", "Power Regulation", "Antenna Compliance", "Labeling Requirements"]
    [intro] => 

This document outlines the modular approval request for a wireless module manufactured by Microchip Technology Inc. The request adheres to Section 15.212 of the FCC regulations, detailing compliance with requirements for modular transmitters. The module features RF shielding, buffered modulation/data inputs, and its own power supply regulation to ensure compliance under various operating conditions.

The document confirms that the module complies with provisions for external power amplifiers and antennas, and has been tested in a stand-alone configuration. It also addresses labeling requirements and compliance with RF exposure limits as per FCC Sections 1.1310 and 2.1093. The modular transmitter complies with all specific rules and operating requirements that ordinarily apply to a complete transmitter. Instructions are provided to the OEM on how to label the end product.

The document is signed by HRUSHIKESH VASUKI, Vice President, Business Unit General Manager, Wireless Solutions Group, Microchip Technology Inc.

)
Array
(
    [0] => Array
        (
            [id] => 8307568
            [file_sha256] => 
            [applicationId] => xTn3Bwn+IL24/JGOcbVs2Q==
            [description] => Modular approval Request letter
            [shortTermConfidential] => No
            [permanentConfidential] => No
            [supercede] => No
            [exhibitType] => Cover Letter(s)
            [fileType] => Adobe Acrobat PDF
            [displayType] => pdf
            [fileSize] => 209208
            [submissionDate] => 2025-05-20 00:00:00
            [dateAvailable] => 2025-05-20 00:00:00
            [creationDate] => 
            [producer] => 
            [modDate] => 
            [title] => 
            [creator] => 
            [author] => 
            [pages] => 
            [realSize] => 
            [html] => 0
            [png] => 0
            [txt] => 0
            [version] => 1
            [source] => 0
            [fccId] => 2ADHKATA8510M
            [cleanFccId] => 2ADHKATA8510M
            [exif] => 0
        )

)