C2PC Cover Letter

File Info : application/pdf, 1 Pages, 30.05KB

Array
(
    [0] => Array
        (
            [url_sha] => 9933b96902cc0cbf1c7d79c0198ee768fde31b4f2de35bcd9f81f3461965b7d6
            [source] => fccid
            [url] => https://apps.fcc.gov/eas/GetApplicationAttachment.html?id=4035671
            [href_text] => C2PC Cover Letter
            [href_description] => Silicon Laboratories Finland Oy BGM13P Bluetooth 5.0 module QOQBGM13P QOQBGM13P bgm13p
            [http_status] => 200
            [http_lastmod] => 0000-00-00 00:00:00
            [http_contenttype] => application/pdf
            [http_filename] => GetApplicationAttachment.html?id=4035671
            [http_size] => 30776
            [file_sha256] => d55f6d480b91bd5cf9547f2ef84628f5364eb91f492d856665bdc947facb6781
            [domain] => document.fccid
        )

)

Array
(
    [0] => Array
        (
            [id] => 4035671
            [file_sha256] => 
            [applicationId] => 4Q1Ihl0oL3H0wFOlQBLGIg==
            [description] => C2PC Cover Letter
            [shortTermConfidential] => No
            [permanentConfidential] => No
            [supercede] => No
            [exhibitType] => Cover Letter(s)
            [fileType] => Adobe Acrobat PDF
            [displayType] => pdf
            [fileSize] => 30776
            [submissionDate] => 2018-10-15 00:00:00
            [dateAvailable] => 2018-10-18 00:00:00
            [creationDate] => 
            [producer] => 
            [modDate] => 
            [title] => 
            [creator] => 
            [author] => 
            [pages] => 
            [realSize] => 
            [html] => 0
            [png] => 0
            [txt] => 0
            [version] => 0
            [source] => 0
            [fccId] => QOQBGM13P
            [cleanFccId] => QOQBGM13P
            [exif] => 0
        )

)