Modular approval Request letter

File Info : application/pdf, 2 Pages, 190.43KB

Array
(
    [0] => Array
        (
            [url_sha] => 735829a4617ee933da21c38fa90868925222511f5c4565254553edaf496615eb
            [source] => fccid
            [url] => https://apps.fcc.gov/eas/GetApplicationAttachment.html?id=7259463
            [href_text] => Modular approval Request letter
            [href_description] => Microchip Technology Inc. WBZ451H  2ADHKWBZ451H 2ADHKWBZ451H wbz451h
            [http_status] => 200
            [http_lastmod] => 0000-00-00 00:00:00
            [http_contenttype] => application/pdf
            [http_filename] => GetApplicationAttachment.html?id=7259463
            [http_size] => 194996
            [file_sha256] => d421b60206107d7f6c5ea0590c28aa7585293858eaf106bf77d0de0cf201d98b
            [domain] => document.fccid
        )

)

Array
(
    [0] => Array
        (
            [id] => 7259463
            [file_sha256] => 
            [applicationId] => 5Kfw9EqdFYAJkDCgPvrqlw==
            [description] => Modular approval Request letter
            [shortTermConfidential] => No
            [permanentConfidential] => No
            [supercede] => No
            [exhibitType] => Cover Letter(s)
            [fileType] => Adobe Acrobat PDF
            [displayType] => pdf
            [fileSize] => 194998
            [submissionDate] => 2024-04-19 00:00:00
            [dateAvailable] => 2024-04-19 00:00:00
            [creationDate] => 
            [producer] => 
            [modDate] => 
            [title] => 
            [creator] => 
            [author] => 
            [pages] => 
            [realSize] => 
            [html] => 0
            [png] => 0
            [txt] => 0
            [version] => 0
            [source] => 0
            [fccId] => 2ADHKWBZ451H
            [cleanFccId] => 2ADHKWBZ451H
            [exif] => 0
        )

)