This document is a declaration from Guangzhou BDE Technology Inc. regarding their BDE BLE Module Based on CC2340R product family. The declaration is intended for Innovation, Science and Economic Development purposes. The document lists a comprehensive range of models within the product family, each identified by a unique model number (HVIN). These models share a common PCB board and structure, with key differences arising from variations in the main chip model (Flash and SRAM sizes), antenna interface location, operating temperature ranges, and the presence of an external 32Mbit SPI Flash.
The models utilize different chipsets, including CC2340R52KP, CC2340R22KP, and CC2340R53KP, with varying Flash and SRAM capacities. Antenna options include PCB Trace Antenna, U.FL Connector, and ANT Pin. Operating temperature ranges vary from -40°C to 85°C and -40°C to 105°C. Some models include an on-board 32Mbit SPI Nor Flash. The document requests certification for these HVINs under the New Family Product Certification, referencing RSP-100 issue 12 Clause 9.3(a) and Clause 9.3(c).
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The models utilize different chipsets, including CC2340R52KP, CC2340R22KP, and CC2340R53KP, with varying Flash and SRAM capacities. Antenna options include PCB Trace Antenna, U.FL Connector, and ANT Pin. Operating temperature ranges vary from -40°C to 85°C and -40°C to 105°C. Some models include an on-board 32Mbit SPI Nor Flash. The document requests certification for these HVINs under the New Family Product Certification, referencing RSP-100 issue 12 Clause 9.3(a) and Clause 9.3(c).
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