CONF Letter

File Info : application/pdf, 1 Pages, 74.95KB

Array
(
    [0] => Array
        (
            [url_sha] => 8d4a43a5445d4c25a28ed57a9894830474649f65f7ea36d549c330c5ff8a6dcd
            [source] => fccid
            [url] => https://apps.fcc.gov/eas/GetApplicationAttachment.html?id=7245695
            [href_text] => CONF Letter
            [href_description] => SHENZHEN SHENGLAI TECHNOLOGY CO.,LIMITED TEM015  2AL9B-TEM015 2AL9BTEM015 tem015
            [http_status] => 200
            [http_lastmod] => 0000-00-00 00:00:00
            [http_contenttype] => application/pdf
            [http_filename] => GetApplicationAttachment.html?id=7245695
            [http_size] => 76745
            [file_sha256] => c8c4986b6823eb7623ad13eb296ff0e6c2aa5ada579b5ddd72ae15814bc376ff
            [domain] => document.fccid
        )

)

Array
(
    [0] => Array
        (
            [id] => 7245695
            [file_sha256] => 
            [applicationId] => nGBhj9m0/MLu5h8WjZPrhg==
            [description] => CONF Letter
            [shortTermConfidential] => No
            [permanentConfidential] => No
            [supercede] => No
            [exhibitType] => Cover Letter(s)
            [fileType] => Adobe Acrobat PDF
            [displayType] => pdf
            [fileSize] => 76746
            [submissionDate] => 2024-04-15 00:00:00
            [dateAvailable] => 2024-04-15 00:00:00
            [creationDate] => 
            [producer] => 
            [modDate] => 
            [title] => 
            [creator] => 
            [author] => 
            [pages] => 
            [realSize] => 
            [html] => 0
            [png] => 0
            [txt] => 0
            [version] => 0
            [source] => 0
            [fccId] => 2AL9B-TEM015
            [cleanFccId] => 2AL9BTEM015
            [exif] => 0
        )

)