modular approval letter

File Info : application/pdf, 3 Pages, 152.84KB

Array
(
    [0] => Array
        (
            [url_sha] => 98e3940a0b450c003ae238ec0d30b251e5046fefe90a294511723ceecf2c2ebc
            [source] => fccid
            [url] => https://apps.fcc.gov/eas/GetApplicationAttachment.html?id=3653339
            [href_text] => modular approval letter
            [href_description] => THALES DIS AlS Deutschland GmbH PLAS9-X Cinterion Module PLAS9-X QIPPLAS9-X QIPPLAS9X plas9 x
            [http_status] => 200
            [http_lastmod] => 0000-00-00 00:00:00
            [http_contenttype] => application/pdf
            [http_filename] => GetApplicationAttachment.html?id=3653339
            [http_size] => 156513
            [file_sha256] => c53b714f029c06d15034fdc98e5548bec852403acde3a4a18d5d0d11fa495187
            [domain] => document.fccid
        )

)

Array
(
    [0] => Array
        (
            [id] => 3653339
            [file_sha256] => 
            [applicationId] => 1tlMlRA9pjxpdkxo5Repvg==
            [description] => modular approval letter
            [shortTermConfidential] => No
            [permanentConfidential] => No
            [supercede] => No
            [exhibitType] => Cover Letter(s)
            [fileType] => Adobe Acrobat PDF
            [displayType] => pdf
            [fileSize] => 156515
            [submissionDate] => 2017-11-27 00:00:00
            [dateAvailable] => 2017-11-27 00:00:00
            [creationDate] => 
            [producer] => 
            [modDate] => 
            [title] => 
            [creator] => 
            [author] => 
            [pages] => 
            [realSize] => 
            [html] => 0
            [png] => 0
            [txt] => 0
            [version] => 0
            [source] => 0
            [fccId] => QIPPLAS9-X
            [cleanFccId] => QIPPLAS9X
            [exif] => 0
        )

)