Conf Letter

File Info : application/pdf, 2 Pages, 131.31KB

Array
(
    [0] => Array
        (
            [url_sha] => 8da1168e4d1952c69b9d2eaa3e0ac90ca62277c312d41d90c1a40eec68335d89
            [source] => fccid
            [url] => https://apps.fcc.gov/eas/GetApplicationAttachment.html?id=2840001
            [href_text] => Conf Letter
            [href_description] => Cypress Semiconductor 4008 Bluetooth Module WAP4008 WAP4008 4008
            [http_status] => 200
            [http_lastmod] => 0000-00-00 00:00:00
            [http_contenttype] => application/pdf
            [http_filename] => GetApplicationAttachment.html?id=2840001
            [http_size] => 134461
            [file_sha256] => c3b4d26d527da99f76ea04adfeb0c2d4fa3d3411cc8192b11cb6eaa19496583c
            [domain] => document.fccid
        )

)

Array
(
    [0] => Array
        (
            [id] => 2840001
            [file_sha256] => 
            [applicationId] => opGzN9yVNCzHR2o9C5AkYg==
            [description] => Conf Letter
            [shortTermConfidential] => No
            [permanentConfidential] => No
            [supercede] => No
            [exhibitType] => Cover Letter(s)
            [fileType] => Adobe Acrobat PDF
            [displayType] => pdf
            [fileSize] => 134462
            [submissionDate] => 2015-12-11 00:00:00
            [dateAvailable] => 2015-12-11 00:00:00
            [creationDate] => 
            [producer] => 
            [modDate] => 
            [title] => 
            [creator] => 
            [author] => 
            [pages] => 
            [realSize] => 
            [html] => 0
            [png] => 0
            [txt] => 0
            [version] => 0
            [source] => 0
            [fccId] => WAP4008
            [cleanFccId] => WAP4008
            [exif] => 0
        )

)