2AF77-H2521550_cvrltr_FCC Confidentiality Request
Microsoft Word 2019
tags: Array
(
[0] => Array
(
[url_sha] => ea3e8b99a4b04d098856d94e55ccb061c67ccbfa418397ff575330e575d5a1c0
[source] => fccid
[url] => https://apps.fcc.gov/eas/GetApplicationAttachment.html?id=8163009
[href_text] => 2AF77-H2521550_cvrltr_FCC Confidentiality Request
[href_description] => Immedia Semiconductor LLC H2521550 Sync module 2AF77-H2521550 2AF77H2521550 h2521550
[http_status] => 200
[http_lastmod] => 0000-00-00 00:00:00
[http_contenttype] =>
[http_filename] => GetApplicationAttachment.html?id=8163009
[http_size] => 115481
[file_sha256] => bee9d15f1861c4a80074b540b18d5dab954c098ac6b4d1a7571acaec72bd394e
[domain] => document.fccid
)
[1] => Array
(
[url_sha] => 3fdfa844bc08fb9502924e5ae1a142287cd9a787d2d02b10a1ef116610084c3d
[source] => fccid
[url] => https://apps.fcc.gov/eas/GetApplicationAttachment.html?id=8163057
[href_text] => 2AF77-H2521550_cvrltr_FCC Confidentiality Request
[href_description] => Immedia Semiconductor LLC H2521550 Sync module 2AF77-H2521550 2AF77H2521550 h2521550
[http_status] => 200
[http_lastmod] => 0000-00-00 00:00:00
[http_contenttype] =>
[http_filename] => GetApplicationAttachment.html?id=8163057
[http_size] => 115481
[file_sha256] => bee9d15f1861c4a80074b540b18d5dab954c098ac6b4d1a7571acaec72bd394e
[domain] => document.fccid
)
)
Array
(
[0] => Array
(
[id] => 8163009
[file_sha256] =>
[applicationId] => YZ9pnn/r8ubQov2BXYdq+w==
[description] => 2AF77-H2521550_cvrltr_FCC Confidentiality Request
[shortTermConfidential] => No
[permanentConfidential] => No
[supercede] => No
[exhibitType] => Cover Letter(s)
[fileType] => Adobe Acrobat PDF
[displayType] => pdf
[fileSize] => 115481
[submissionDate] => 2025-04-01 00:00:00
[dateAvailable] => 2025-04-02 00:00:00
[creationDate] =>
[producer] =>
[modDate] =>
[title] =>
[creator] =>
[author] =>
[pages] =>
[realSize] =>
[html] => 0
[png] => 0
[txt] => 0
[version] => 0
[source] => 0
[fccId] => 2AF77-H2521550
[cleanFccId] => 2AF77H2521550
[exif] => 0
)
)