This document details the thermal and antenna characteristics of the IWR6843AOP FCBGA package. It provides essential information for understanding the device's thermal performance, including junction-to-case, junction-to-board, and junction-to-air thermal resistance values. These values are based on JEDEC standards and are crucial for effective thermal management in various applications.
The document also explores the antenna radiation patterns for both transmitter and receiver, presenting typical antenna gain plots normalized to boresight at different frequencies. These patterns are provided for both Azimuth (H-Plane) and Elevation (E-Plane) planes, offering a comprehensive view of the antenna's performance. Furthermore, the document illustrates the antenna positions and relative spacing, which are critical for understanding the device's overall antenna design.
Finally, the document outlines the power supply sequencing and reset timing requirements for the IWR6843AOP, ensuring proper device initialization and operation. This information is vital for system designers to ensure the device functions correctly and reliably.