Modular Approval Letter

File Info : application/pdf, 2 Pages, 243.64KB

Array
(
    [0] => Array
        (
            [url_sha] => 3775a391d39ef4278f5481bdb36bb394dc00340ef2899893e5de6f22115f24cf
            [source] => fccid
            [url] => https://apps.fcc.gov/eas/GetApplicationAttachment.html?id=6724472
            [href_text] => Modular Approval Letter
            [href_description] => Quectel Wireless Solutions Company Limited 2023HLM311Z  XMR2023HLM311Z XMR2023HLM311Z 2023hlm311z
            [http_status] => 200
            [http_lastmod] => 0000-00-00 00:00:00
            [http_contenttype] => application/pdf
            [http_filename] => GetApplicationAttachment.html?id=6724472
            [http_size] => 249487
            [file_sha256] => b8110ffeaa37790dce8519d64c4f1025af34a4a409575e3285e8555eea6fd234
            [domain] => document.fccid
        )

)

Array
(
    [0] => Array
        (
            [id] => 6724472
            [file_sha256] => 
            [applicationId] => LLV8OIRMdUG+ujeuBkqfJw==
            [description] => Modular Approval Letter
            [shortTermConfidential] => No
            [permanentConfidential] => No
            [supercede] => No
            [exhibitType] => Cover Letter(s)
            [fileType] => Adobe Acrobat PDF
            [displayType] => pdf
            [fileSize] => 249487
            [submissionDate] => 2023-08-10 00:00:00
            [dateAvailable] => 2023-08-10 00:00:00
            [creationDate] => 
            [producer] => 
            [modDate] => 
            [title] => 
            [creator] => 
            [author] => 
            [pages] => 
            [realSize] => 
            [html] => 0
            [png] => 0
            [txt] => 0
            [version] => 0
            [source] => 0
            [fccId] => XMR2023HLM311Z
            [cleanFccId] => XMR2023HLM311Z
            [exif] => 0
        )

)