C2PC Cover letter

File Info : application/pdf, 3 Pages, 166.05KB

Array
(
    [0] => Array
        (
            [url_sha] => 1ddacf365c4b91e6765080b904c3b58deac78636472705d2083034f50bef8ecd
            [source] => fccid
            [url] => https://apps.fcc.gov/eas/GetApplicationAttachment.html?id=5528252
            [href_text] => C2PC Cover letter
            [href_description] => RYDER ELECTRONICS(SHENZHEN)LTD RB2107 Bluetooth Module 2A3BF-RB2107 2A3BFRB2107 rb2107
            [http_status] => 200
            [http_lastmod] => 0000-00-00 00:00:00
            [http_contenttype] => application/pdf
            [http_filename] => GetApplicationAttachment.html?id=5528252
            [http_size] => 170039
            [file_sha256] => b15dd81cd200f9907ddad3a556dd60c98e66679aeae6712a5b11081226bbe7d6
            [domain] => document.fccid
        )

)

Array
(
    [0] => Array
        (
            [id] => 5528252
            [file_sha256] => 
            [applicationId] => cpLqOSCCEkVy8rONECVuYQ==
            [description] => C2PC Cover letter
            [shortTermConfidential] => No
            [permanentConfidential] => No
            [supercede] => No
            [exhibitType] => Cover Letter(s)
            [fileType] => Adobe Acrobat PDF
            [displayType] => pdf
            [fileSize] => 170041
            [submissionDate] => 2021-11-08 00:00:00
            [dateAvailable] => 2021-11-08 00:00:00
            [creationDate] => 
            [producer] => 
            [modDate] => 
            [title] => 
            [creator] => 
            [author] => 
            [pages] => 
            [realSize] => 
            [html] => 0
            [png] => 0
            [txt] => 0
            [version] => 0
            [source] => 0
            [fccId] => 2A3BF-RB2107
            [cleanFccId] => 2A3BFRB2107
            [exif] => 0
        )

)