Modular Approval Letter

File Info : application/pdf, 3 Pages, 267.02KB

Array
(
    [0] => Array
        (
            [url_sha] => 0491fffc376d7b331d64d23916b2f843b3d576ace24e6d4e5de80e7f0724f51a
            [source] => fccid
            [url] => https://apps.fcc.gov/eas/GetApplicationAttachment.html?id=4491783
            [href_text] => Modular Approval Letter
            [href_description] => MeiG Smart Technology Co., Ltd SLM756P Smart Module 2APJ4-SLM756P 2APJ4SLM756P slm756p
            [http_status] => 200
            [http_lastmod] => 0000-00-00 00:00:00
            [http_contenttype] => application/pdf
            [http_filename] => GetApplicationAttachment.html?id=4491783
            [http_size] => 273430
            [file_sha256] => ada394150c5883e895110757a3f93de04a1ab0a4dc42974bb970763661e2d7e4
            [domain] => document.fccid
        )

)

Array
(
    [0] => Array
        (
            [id] => 4491783
            [file_sha256] => 
            [applicationId] => YhL2SnhHNBh0fkXQypYBDg==
            [description] => Modular Approval Letter
            [shortTermConfidential] => No
            [permanentConfidential] => No
            [supercede] => No
            [exhibitType] => Cover Letter(s)
            [fileType] => Adobe Acrobat PDF
            [displayType] => pdf
            [fileSize] => 275092
            [submissionDate] => 2019-10-26 00:00:00
            [dateAvailable] => 2019-10-26 00:00:00
            [creationDate] => 
            [producer] => 
            [modDate] => 
            [title] => 
            [creator] => 
            [author] => 
            [pages] => 
            [realSize] => 
            [html] => 0
            [png] => 0
            [txt] => 0
            [version] => 0
            [source] => 0
            [fccId] => 2APJ4-SLM756P
            [cleanFccId] => 2APJ4SLM756P
            [exif] => 0
        )

)