FCC_Modular Cover letter

File Info : application/pdf, 2 Pages, 151.29KB

Array
(
    [0] => Array
        (
            [url_sha] => 384338f4c630b47014c0cb38bb95b0c785bc64749d37f4e421e1b0ffd7009e59
            [source] => fccid
            [url] => https://apps.fcc.gov/eas/GetApplicationAttachment.html?id=7530437
            [href_text] => FCC_Modular Cover letter
            [href_description] => Cypress Semiconductor 739I05  WAP739I05 WAP739I05 739i05
            [http_status] => 200
            [http_lastmod] => 0000-00-00 00:00:00
            [http_contenttype] => application/pdf
            [http_filename] => GetApplicationAttachment.html?id=7530437
            [http_size] => 154921
            [file_sha256] => ad8dd13265bfd47b548708be2da90a4b5e81c7f999e21fad9972373a2c6d7990
            [domain] => document.fccid
        )

)

Array
(
    [0] => Array
        (
            [id] => 7530437
            [file_sha256] => 
            [applicationId] => p/zqH1O0fx1jdp3DK9idOg==
            [description] => FCC_Modular Cover letter
            [shortTermConfidential] => No
            [permanentConfidential] => No
            [supercede] => No
            [exhibitType] => Cover Letter(s)
            [fileType] => Adobe Acrobat PDF
            [displayType] => pdf
            [fileSize] => 154923
            [submissionDate] => 2024-08-02 00:00:00
            [dateAvailable] => 2024-08-02 00:00:00
            [creationDate] => 
            [producer] => 
            [modDate] => 
            [title] => 
            [creator] => 
            [author] => 
            [pages] => 
            [realSize] => 
            [html] => 0
            [png] => 0
            [txt] => 0
            [version] => 0
            [source] => 0
            [fccId] => WAP739I05
            [cleanFccId] => WAP739I05
            [exif] => 0
        )

)