This document presents a comprehensive collection of EUT (Equipment Under Test) internal photographs, meticulously captured by JianYan Testing Group Shenzhen Co., Ltd. The images provide a detailed visual exploration of the device's internal components, showcasing the intricate design and construction. The photos include close-ups of the mainboard, sub-board, battery, and various modules, offering valuable insights into the device's architecture.
Key components such as the MediaTek MT67 and MT8791V chipsets are clearly visible, along with other critical integrated circuits. The battery, model BAT22M23H22000, is also featured, displaying its specifications and certifications. Antenna placements for BT/WiFi/GPS, GSM/WCDMA/LTE, and NFC are highlighted, providing a clear understanding of the device's wireless communication capabilities. The document serves as an essential resource for understanding the internal structure and component arrangement of the tested device.
Array
(
[0] => Array
(
[url_sha] => c59b850e5a688aa65edb1b9a923deb2e0a473c338e4bfdd6341461c85a421e23
[source] => fccid
[url] => https://apps.fcc.gov/eas/GetApplicationAttachment.html?id=8254658
[href_text] => Internal photos
[href_description] => Shenzhen DOOGEE Hengtong Technology CO.,LTD VMAXS Smart Phone 2AX4YVMAXS 2AX4YVMAXS vmaxs
[http_status] => 200
[http_lastmod] => 0000-00-00 00:00:00
[http_contenttype] =>
[http_filename] => GetApplicationAttachment.html?id=8254658
[http_size] => 3806331
[file_sha256] => a27e54729603eaa3f77497e36dd96e048a21d549643e33fbccc3f1b896b467ef
[domain] => document.fccid
)
[1] => Array
(
[url_sha] => b7a1d4241a7448806036eb338b5234c60869e9d122c34adcc886d464cb244acc
[source] => fccid
[url] => https://apps.fcc.gov/eas/GetApplicationAttachment.html?id=8255040
[href_text] => Internal photos
[href_description] => Shenzhen DOOGEE Hengtong Technology CO.,LTD VMAXS Smart Phone 2AX4YVMAXS 2AX4YVMAXS vmaxs
[http_status] => 200
[http_lastmod] => 0000-00-00 00:00:00
[http_contenttype] =>
[http_filename] => GetApplicationAttachment.html?id=8255040
[http_size] => 3806331
[file_sha256] => a27e54729603eaa3f77497e36dd96e048a21d549643e33fbccc3f1b896b467ef
[domain] => document.fccid
)
[2] => Array
(
[url_sha] => d4a4813e624f022c4e3fbb459473f8bfd4690a6edd9d84ff7fa73750088d665d
[source] => fccid
[url] => https://apps.fcc.gov/eas/GetApplicationAttachment.html?id=8255220
[href_text] => Internal photos
[href_description] => Shenzhen DOOGEE Hengtong Technology CO.,LTD VMAXS Smart Phone 2AX4YVMAXS 2AX4YVMAXS vmaxs
[http_status] => 200
[http_lastmod] => 0000-00-00 00:00:00
[http_contenttype] =>
[http_filename] => GetApplicationAttachment.html?id=8255220
[http_size] => 3806331
[file_sha256] => a27e54729603eaa3f77497e36dd96e048a21d549643e33fbccc3f1b896b467ef
[domain] => document.fccid
)
)
Array
(
[file_sha256] => a27e54729603eaa3f77497e36dd96e048a21d549643e33fbccc3f1b896b467ef
[cleanFccId] => 2AX4YVMAXS
[title] => JianYan Testing Group: EUT Internal Photos of Device
[description] => A detailed look inside the device with high-resolution EUT internal photos from JianYan Testing Group Shenzhen Co., Ltd.
[brand_name] => JianYan Testing Group
[keywords] => ["JYTSZR2502019", "BAT22M23H22000", "MT67", "MT8791V", "MT6190MV", "MT6365VMW", "GB 31241-2014", "QCGS658BRF0037G-A0", "QCGS658BRF0038G_A0", "M23HE", "M23H-ANT1-V2", "M23H-ANT4-V2"]
[intro] =>
This document presents a comprehensive collection of EUT (Equipment Under Test) internal photographs, meticulously captured by JianYan Testing Group Shenzhen Co., Ltd. The images provide a detailed visual exploration of the device's internal components, showcasing the intricate design and construction. The photos include close-ups of the mainboard, sub-board, battery, and various modules, offering valuable insights into the device's architecture.
Key components such as the MediaTek MT67 and MT8791V chipsets are clearly visible, along with other critical integrated circuits. The battery, model BAT22M23H22000, is also featured, displaying its specifications and certifications. Antenna placements for BT/WiFi/GPS, GSM/WCDMA/LTE, and NFC are highlighted, providing a clear understanding of the device's wireless communication capabilities. The document serves as an essential resource for understanding the internal structure and component arrangement of the tested device.
)
Array
(
[0] => Array
(
[id] => 8254658
[file_sha256] =>
[applicationId] => bijnLBNUMxPhlFzsFS4Zhg==
[description] => Internal photos
[shortTermConfidential] => No
[permanentConfidential] => No
[supercede] => No
[exhibitType] => Internal Photos
[fileType] => Adobe Acrobat PDF
[displayType] => pdf
[fileSize] => 3806331
[submissionDate] => 2025-04-30 00:00:00
[dateAvailable] => 2025-04-30 00:00:00
[creationDate] =>
[producer] =>
[modDate] =>
[title] =>
[creator] =>
[author] =>
[pages] =>
[realSize] =>
[html] => 0
[png] => 0
[txt] => 0
[version] => 1
[source] => 0
[fccId] => 2AX4YVMAXS
[cleanFccId] => 2AX4YVMAXS
[exif] => 0
)
)