Model Diffrence Letter

File Info : application/pdf, 1 Pages, 97.18KB

Array
(
    [0] => Array
        (
            [url_sha] => 7887eb6c26a830d7981b2fb5f8c4ac4277e140f1d7717f9d4201663c29160d5b
            [source] => fccid
            [url] => https://apps.fcc.gov/eas/GetApplicationAttachment.html?id=3375695
            [href_text] => Model Diffrence Letter
            [href_description] => Cypress Semiconductor 3025 Bluetooth Module WAP3025 WAP3025 3025
            [http_status] => 200
            [http_lastmod] => 0000-00-00 00:00:00
            [http_contenttype] => application/pdf
            [http_filename] => GetApplicationAttachment.html?id=3375695
            [http_size] => 99514
            [file_sha256] => a259658d4d8604dc5799bf43d45c6a28db6629f2bb2a74a94adc2cebd70ee466
            [domain] => document.fccid
        )

)

Array
(
    [0] => Array
        (
            [id] => 3375695
            [file_sha256] => 
            [applicationId] => MFdwF96rhYTKZSRwEFCN3w==
            [description] => Model Diffrence Letter
            [shortTermConfidential] => No
            [permanentConfidential] => No
            [supercede] => No
            [exhibitType] => Cover Letter(s)
            [fileType] => Adobe Acrobat PDF
            [displayType] => pdf
            [fileSize] => 99514
            [submissionDate] => 2017-04-29 00:00:00
            [dateAvailable] => 2017-05-01 00:00:00
            [creationDate] => 
            [producer] => 
            [modDate] => 
            [title] => 
            [creator] => 
            [author] => 
            [pages] => 
            [realSize] => 
            [html] => 0
            [png] => 0
            [txt] => 0
            [version] => 0
            [source] => 0
            [fccId] => WAP3025
            [cleanFccId] => WAP3025
            [exif] => 0
        )

)