C2PC letter
tags: Array
(
[0] => Array
(
[url_sha] => 92453080875ff37fa8ef62f36fcf6c016d5606baa3a4d7ddb3ff3c680588dd8c
[source] => fccid
[url] => https://apps.fcc.gov/eas/GetApplicationAttachment.html?id=5195197
[href_text] => C2PC letter
[href_description] => Shanghai Simcom Ltd. 201710 LTE-FDD/HSPA MODULE UDV-201710 UDV201710 201710
[http_status] => 200
[http_lastmod] => 0000-00-00 00:00:00
[http_contenttype] => application/pdf
[http_filename] => GetApplicationAttachment.html?id=5195197
[http_size] => 319135
[file_sha256] => 9ad7aaa12e2c79091b6bfa49978d59fd860d6534ab325a0ff8b44a7280c22cc5
[domain] => document.fccid
)
)
Array
(
[0] => Array
(
[id] => 5195197
[file_sha256] =>
[applicationId] => ZnQZkQZKoSJvAE+3fB5bKg==
[description] => C2PC letter
[shortTermConfidential] => No
[permanentConfidential] => No
[supercede] => No
[exhibitType] => Cover Letter(s)
[fileType] => Adobe Acrobat PDF
[displayType] => pdf
[fileSize] => 319136
[submissionDate] => 2021-04-08 00:00:00
[dateAvailable] => 2021-04-12 00:00:00
[creationDate] =>
[producer] =>
[modDate] =>
[title] =>
[creator] =>
[author] =>
[pages] =>
[realSize] =>
[html] => 0
[png] => 0
[txt] => 0
[version] => 0
[source] => 0
[fccId] => UDV-201710
[cleanFccId] => UDV201710
[exif] => 0
)
)