Modular Approval Letter
Microsoft Office Word 2007 Microsoft Office Word 2007
tags: Array
(
[0] => Array
(
[url_sha] => 4de7d6e5bd0a358ad26771e8f4b7e1eebedbf371e5d40216683e65d264d8cbf9
[source] => fccid
[url] => https://apps.fcc.gov/eas/GetApplicationAttachment.html?id=3335044
[href_text] => Modular Approval Letter
[href_description] => ST Microelectronics S.R.L. SPSGPE SPSGPE-915 SubGiga Module S9NSPSGPE S9NSPSGPE spsgpe
[http_status] => 200
[http_lastmod] => 0000-00-00 00:00:00
[http_contenttype] => application/pdf
[http_filename] => GetApplicationAttachment.html?id=3335044
[http_size] => 172985
[file_sha256] => 878f1534ded368774739461c50ba3dedcb92b7bda31786feeab5650efdad32fa
[domain] => document.fccid
)
)
Array
(
[0] => Array
(
[id] => 3335044
[file_sha256] =>
[applicationId] => 3xqy+7XEYOcEWRfSud/wVQ==
[description] => Modular Approval Letter
[shortTermConfidential] => No
[permanentConfidential] => No
[supercede] => No
[exhibitType] => Cover Letter(s)
[fileType] => Adobe Acrobat PDF
[displayType] => pdf
[fileSize] => 172985
[submissionDate] => 2017-03-28 00:00:00
[dateAvailable] => 2017-03-29 00:00:00
[creationDate] =>
[producer] =>
[modDate] =>
[title] =>
[creator] =>
[author] =>
[pages] =>
[realSize] =>
[html] => 0
[png] => 0
[txt] => 0
[version] => 0
[source] => 0
[fccId] => S9NSPSGPE
[cleanFccId] => S9NSPSGPE
[exif] => 0
)
)