Cover Letter - Agent Authorization.pdf

File Info : application/pdf, 1 Pages, 37.16KB

Array
(
    [0] => Array
        (
            [url_sha] => 6dcae4f08795fce076108b2e17cbd902211a6d14c9b2a7478811a266520e9191
            [source] => fccid
            [url] => https://apps.fcc.gov/eas/GetApplicationAttachment.html?id=2599773
            [href_text] => Cover Letter - Agent Authorization.pdf
            [href_description] => Microelectronics Technology Inc RU00-M03 RFID HP-SIP Module MAD-RU00-M03 MADRU00M03 ru00 m03
            [http_status] => 200
            [http_lastmod] => 0000-00-00 00:00:00
            [http_contenttype] => application/pdf
            [http_filename] => GetApplicationAttachment.html?id=2599773
            [http_size] => 38049
            [file_sha256] => 77a06194b792ebb034caae1a8a321357e2ab1c315af72f6f6b32372c2cc84e62
            [domain] => document.fccid
        )

)

Array
(
    [0] => Array
        (
            [id] => 2599773
            [file_sha256] => 
            [applicationId] => wJ02OQCgxz+XuEIURn4hNw==
            [description] => Cover Letter - Agent Authorization.pdf
            [shortTermConfidential] => No
            [permanentConfidential] => No
            [supercede] => No
            [exhibitType] => Cover Letter(s)
            [fileType] => Adobe Acrobat PDF
            [displayType] => pdf
            [fileSize] => 38051
            [submissionDate] => 2015-04-29 00:00:00
            [dateAvailable] => 2015-04-29 00:00:00
            [creationDate] => 
            [producer] => 
            [modDate] => 
            [title] => 
            [creator] => 
            [author] => 
            [pages] => 
            [realSize] => 
            [html] => 0
            [png] => 0
            [txt] => 0
            [version] => 0
            [source] => 0
            [fccId] => MAD-RU00-M03
            [cleanFccId] => MADRU00M03
            [exif] => 0
        )

)