Cover Letter (Description of Change)

File Info : application/pdf, 1 Pages, 80.61KB

Array
(
    [0] => Array
        (
            [url_sha] => 5e614d7d90fae27deaa14fa78dcd2625d0f0de3c6f64bcf21054d04f822ed4cf
            [source] => fccid
            [url] => https://apps.fcc.gov/eas/GetApplicationAttachment.html?id=5481813
            [href_text] => Cover Letter (Description of Change)
            [href_description] => Qualcomm Technologies, Inc. QCNFA765 Wi-Fi 6E BT 5.2 M.2 2230 Module J9C-QCNFA765 J9CQCNFA765 qcnfa765
            [http_status] => 200
            [http_lastmod] => 0000-00-00 00:00:00
            [http_contenttype] => application/pdf
            [http_filename] => GetApplicationAttachment.html?id=5481813
            [http_size] => 82546
            [file_sha256] => 6bef2304a281dbeea6af8b0636d043400d779c9f47ee94ca6dd6cb9c055567e3
            [domain] => document.fccid
        )

)

Array
(
    [0] => Array
        (
            [id] => 5481813
            [file_sha256] => 
            [applicationId] => +PBvzokuTF4um/mT6zocdA==
            [description] => Cover Letter (Description of Change)
            [shortTermConfidential] => No
            [permanentConfidential] => No
            [supercede] => No
            [exhibitType] => Cover Letter(s)
            [fileType] => Adobe Acrobat PDF
            [displayType] => pdf
            [fileSize] => 82548
            [submissionDate] => 2021-10-05 00:00:00
            [dateAvailable] => 2021-11-02 00:00:00
            [creationDate] => 
            [producer] => 
            [modDate] => 
            [title] => 
            [creator] => 
            [author] => 
            [pages] => 
            [realSize] => 
            [html] => 0
            [png] => 0
            [txt] => 0
            [version] => 0
            [source] => 0
            [fccId] => J9C-QCNFA765
            [cleanFccId] => J9CQCNFA765
            [exif] => 0
        )

)