Chip Declaration Letter

File Info : application/pdf, 1 Pages, 227.80KB

Array
(
    [0] => Array
        (
            [url_sha] => 176315a0c490ca9b4d343b2194497f445ac7774978bf25b6954b7f3aa2f0e53b
            [source] => fccid
            [url] => https://apps.fcc.gov/eas/GetApplicationAttachment.html?id=4795450
            [href_text] => Chip Declaration Letter
            [href_description] => Chengdu Vantron Technology Co., Ltd. AP6255 Module 2AAGEAP6255 2AAGEAP6255 ap6255
            [http_status] => 200
            [http_lastmod] => 0000-00-00 00:00:00
            [http_contenttype] => application/pdf
            [http_filename] => GetApplicationAttachment.html?id=4795450
            [http_size] => 233271
            [file_sha256] => 692916a1010bd744193cb38550b101aab0805a71cdbb49c6d8efc4f27c68ec71
            [domain] => document.fccid
        )

)

Array
(
    [0] => Array
        (
            [id] => 4795450
            [file_sha256] => 
            [applicationId] => Bn5FUfYzRsEkZlvIsdR5bg==
            [description] => Chip Declaration Letter
            [shortTermConfidential] => No
            [permanentConfidential] => No
            [supercede] => No
            [exhibitType] => Cover Letter(s)
            [fileType] => Adobe Acrobat PDF
            [displayType] => pdf
            [fileSize] => 233271
            [submissionDate] => 2020-07-07 00:00:00
            [dateAvailable] => 2020-07-07 00:00:00
            [creationDate] => 
            [producer] => 
            [modDate] => 
            [title] => 
            [creator] => 
            [author] => 
            [pages] => 
            [realSize] => 
            [html] => 0
            [png] => 0
            [txt] => 0
            [version] => 0
            [source] => 0
            [fccId] => 2AAGEAP6255
            [cleanFccId] => 2AAGEAP6255
            [exif] => 0
        )

)