231128-05.TR02_FCC_WWAN SAR_HP_HSN-I61C wFM350GL_Rev01

File Info : application/pdf, 154 Pages, 4.94MB

Array
(
    [0] => Array
        (
            [url_sha] => 0d7c1d7a1bd5dbccf52fb0e11595e320663628d1e59448ed45eabab0a4d531bb
            [source] => fccid
            [url] => https://apps.fcc.gov/eas/GetApplicationAttachment.html?id=7222409
            [href_text] => 231128-05.TR02_FCC_WWAN SAR_HP_HSN-I61C wFM350GL_Rev01
            [href_description] => HP Inc. HNI61CKL4 HSN-I61C B94HNI61CKL4 B94HNI61CKL4 hni61ckl4
            [http_status] => 200
            [http_lastmod] => 0000-00-00 00:00:00
            [http_contenttype] => application/pdf
            [http_filename] => GetApplicationAttachment.html?id=7222409
            [http_size] => 5178817
            [file_sha256] => 5d131d8a5e94f33eceb2bd8246fbf796b1c0bdbf9c08eaf2adf3b0d209f8fc46
            [domain] => document.fccid
        )

    [1] => Array
        (
            [url_sha] => c482dbc3a78a238285b858d3b24b35c342c615e620fc21db8e7ecaffcce347a9
            [source] => fccid
            [url] => https://apps.fcc.gov/eas/GetApplicationAttachment.html?id=7222410
            [href_text] => 231128-05.TR02_FCC_WWAN SAR_HP_HSN-I61C wFM350GL_Rev01_Annex_F
            [href_description] => HP Inc. HNI61CKL4 HSN-I61C B94HNI61CKL4 B94HNI61CKL4 hni61ckl4
            [http_status] => 200
            [http_lastmod] => 0000-00-00 00:00:00
            [http_contenttype] => application/pdf
            [http_filename] => GetApplicationAttachment.html?id=7222410
            [http_size] => 5178817
            [file_sha256] => 5d131d8a5e94f33eceb2bd8246fbf796b1c0bdbf9c08eaf2adf3b0d209f8fc46
            [domain] => document.fccid
        )

    [2] => Array
        (
            [url_sha] => a1f732e07e8e96256e1563d05ac4490ee4828a553bf68b3cbf65f75d485722bf
            [source] => fccid
            [url] => https://apps.fcc.gov/eas/GetApplicationAttachment.html?id=7222576
            [href_text] => 231128-05.TR02_FCC_WWAN SAR_HP_HSN-I61C wFM350GL_Rev01
            [href_description] => HP Inc. HNI61CKL4 HSN-I61C B94HNI61CKL4 B94HNI61CKL4 hni61ckl4
            [http_status] => 200
            [http_lastmod] => 0000-00-00 00:00:00
            [http_contenttype] => application/pdf
            [http_filename] => GetApplicationAttachment.html?id=7222576
            [http_size] => 5178817
            [file_sha256] => 5d131d8a5e94f33eceb2bd8246fbf796b1c0bdbf9c08eaf2adf3b0d209f8fc46
            [domain] => document.fccid
        )

)

Array
(
    [0] => Array
        (
            [id] => 7222409
            [file_sha256] => 
            [applicationId] => OkCHBODtuUhMZQHcKzCQ+w==
            [description] => 231128-05.TR02_FCC_WWAN SAR_HP_HSN-I61C wFM350GL_Rev01
            [shortTermConfidential] => No
            [permanentConfidential] => No
            [supercede] => No
            [exhibitType] => RF Exposure Info
            [fileType] => Adobe Acrobat PDF
            [displayType] => pdf
            [fileSize] => 5178819
            [submissionDate] => 2024-04-03 00:00:00
            [dateAvailable] => 2024-04-09 00:00:00
            [creationDate] => 
            [producer] => 
            [modDate] => 
            [title] => 
            [creator] => 
            [author] => 
            [pages] => 
            [realSize] => 
            [html] => 0
            [png] => 0
            [txt] => 0
            [version] => 0
            [source] => 0
            [fccId] => B94HNI61CKL4
            [cleanFccId] => B94HNI61CKL4
            [exif] => 0
        )

)