Application Letter
tags: Array
(
[0] => Array
(
[url_sha] => f8a07a9da33f777d91eede7a9045eafb6fc7616ff8fafa1cd8371c5e036a45ec
[source] => fccid
[url] => https://apps.fcc.gov/eas/GetApplicationAttachment.html?id=652605
[href_text] => Application Letter
[href_description] => D-Link Corporation DIR625A1 2.4GHz 802.11n MPCI Module KA2DIR625A1 KA2DIR625A1 dir625a1
[http_status] => 200
[http_lastmod] => 0000-00-00 00:00:00
[http_contenttype] => application/pdf
[http_filename] => GetApplicationAttachment.html?id=652605
[http_size] => 79436
[file_sha256] => 58b6639807f07a14a33fce0e9ca5fa873d420f8fa71fccd4ab0b88382d8e1e26
[domain] => document.fccid
)
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Array
(
[0] => Array
(
[id] => 652605
[file_sha256] =>
[applicationId] => uHfHyR/RTnQrMLcb0DvCMA==
[description] => Application Letter
[shortTermConfidential] => No
[permanentConfidential] => No
[supercede] => No
[exhibitType] => Cover Letter(s)
[fileType] => Adobe Acrobat PDF
[displayType] => pdf
[fileSize] => 79438
[submissionDate] => 2006-04-28 00:00:00
[dateAvailable] => 2006-04-26 00:00:00
[creationDate] =>
[producer] =>
[modDate] =>
[title] =>
[creator] =>
[author] =>
[pages] =>
[realSize] =>
[html] => 0
[png] => 0
[txt] => 0
[version] => 0
[source] => 0
[fccId] => KA2DIR625A1
[cleanFccId] => KA2DIR625A1
[exif] => 0
)
)