J9C-M2X35_cvrltr_FCC Modular Approval Letter_QTI
tags: Array
(
[0] => Array
(
[url_sha] => 56c49a8556feea7e9df5d055a15c93b169c115d9ea2410ccbf9cc596fc961fb5
[source] => fccid
[url] => https://apps.fcc.gov/eas/GetApplicationAttachment.html?id=7891416
[href_text] => J9C-M2X35_cvrltr_FCC Modular Approval Letter_QTI
[href_description] => Qualcomm Technologies, Inc. M2X35 Module J9C-M2X35 J9CM2X35 m2x35
[http_status] => 200
[http_lastmod] => 0000-00-00 00:00:00
[http_contenttype] => application/pdf
[http_filename] => GetApplicationAttachment.html?id=7891416
[http_size] => 152663
[file_sha256] => 5678f642955b59e6cee4eca5a80957e2a91caca8f8f305c131ea675ec7ef0e16
[domain] => document.fccid
)
[1] => Array
(
[url_sha] => 6f38b5ed3c009ef33770b5da3b9c4b880186ea662ce3d4e25fdc448e8216558b
[source] => fccid
[url] => https://apps.fcc.gov/eas/GetApplicationAttachment.html?id=7891088
[href_text] => J9C-M2X35_cvrltr_FCC Modular Approval Letter_QTI
[href_description] => Qualcomm Technologies, Inc. M2X35 Module J9C-M2X35 J9CM2X35 m2x35
[http_status] => 200
[http_lastmod] => 0000-00-00 00:00:00
[http_contenttype] => application/pdf
[http_filename] => GetApplicationAttachment.html?id=7891088
[http_size] => 152663
[file_sha256] => 5678f642955b59e6cee4eca5a80957e2a91caca8f8f305c131ea675ec7ef0e16
[domain] => document.fccid
)
)
Array
(
[0] => Array
(
[id] => 7891088
[file_sha256] =>
[applicationId] => C7eNiX+jWjzpnuSoq/SBkA==
[description] => J9C-M2X35_cvrltr_FCC Modular Approval Letter_QTI
[shortTermConfidential] => No
[permanentConfidential] => No
[supercede] => No
[exhibitType] => Cover Letter(s)
[fileType] => Adobe Acrobat PDF
[displayType] => pdf
[fileSize] => 152665
[submissionDate] => 2024-12-11 00:00:00
[dateAvailable] => 2024-12-11 00:00:00
[creationDate] =>
[producer] =>
[modDate] =>
[title] =>
[creator] =>
[author] =>
[pages] =>
[realSize] =>
[html] => 0
[png] => 0
[txt] => 0
[version] => 0
[source] => 0
[fccId] => J9C-M2X35
[cleanFccId] => J9CM2X35
[exif] => 0
)
)