Authorization letter
tags: Array
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[0] => Array
(
[url_sha] => 61a6351f8aaa2a27016bb0cde9190c7538b3f84773de7fa77ea491f599897d8e
[source] => fccid
[url] => https://apps.fcc.gov/eas/GetApplicationAttachment.html?id=8135898
[href_text] => Authorization letter
[href_description] => Shenzhen Honq Technology Co., Ltd 82071806220916 LTE module 2BNH282071806220916 2BNH282071806220916 82071806220916
[http_status] => 200
[http_lastmod] => 0000-00-00 00:00:00
[http_contenttype] => application/pdf
[http_filename] => GetApplicationAttachment.html?id=8135898
[http_size] => 138242
[file_sha256] => 555fa6fdcc1f5bd0edd74e5824d96f25a9c95703e436bab2ff0d7b1403c4bcae
[domain] => document.fccid
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[1] => Array
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[url_sha] => 0ed8fc37badc4d3796fe9d81ecf02a1724f289ee74e5d121611a64e6962094c2
[source] => fccid
[url] => https://apps.fcc.gov/eas/GetApplicationAttachment.html?id=8135867
[href_text] => Authorization letter
[href_description] => Shenzhen Honq Technology Co., Ltd 82071806220916 LTE module 2BNH282071806220916 2BNH282071806220916 82071806220916
[http_status] => 200
[http_lastmod] => 0000-00-00 00:00:00
[http_contenttype] => application/pdf
[http_filename] => GetApplicationAttachment.html?id=8135867
[http_size] => 138242
[file_sha256] => 555fa6fdcc1f5bd0edd74e5824d96f25a9c95703e436bab2ff0d7b1403c4bcae
[domain] => document.fccid
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Array
(
[0] => Array
(
[id] => 8135867
[file_sha256] =>
[applicationId] => /X4qPrwK1/fLxoQ3mCoaEQ==
[description] => Authorization letter
[shortTermConfidential] => No
[permanentConfidential] => No
[supercede] => No
[exhibitType] => Cover Letter(s)
[fileType] => Adobe Acrobat PDF
[displayType] => pdf
[fileSize] => 138243
[submissionDate] => 2025-03-21 00:00:00
[dateAvailable] => 2025-03-21 00:00:00
[creationDate] =>
[producer] =>
[modDate] =>
[title] =>
[creator] =>
[author] =>
[pages] =>
[realSize] =>
[html] => 0
[png] => 0
[txt] => 0
[version] => 0
[source] => 0
[fccId] => 2BNH282071806220916
[cleanFccId] => 2BNH282071806220916
[exif] => 0
)
)