Cover Letter (Description of Change)


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tags:
Array
(
    [0] => Array
        (
            [url_sha] => ec4e3949c3b942ddf7ee15b7edf79d9db8e62f71c2551f6208b867c82ec697e9
            [source] => fccid
            [url] => https://apps.fcc.gov/eas/GetApplicationAttachment.html?id=6770839
            [href_text] => Cover Letter (Description of Change)
            [href_description] => Qualcomm Technologies, Inc. QCNCM865 Qualcomm WiFi 7/BT Combo module J9C-QCNCM865 J9CQCNCM865 qcncm865
            [http_status] => 200
            [http_lastmod] => 0000-00-00 00:00:00
            [http_contenttype] => application/pdf
            [http_filename] => GetApplicationAttachment.html?id=6770839
            [http_size] => 288507
            [file_sha256] => 50c2dc7efe460d7e3990f936fb227d803e109d7bf26437f3b32397c9ef3c40bc
            [domain] => document.fccid
        )

    [1] => Array
        (
            [url_sha] => 55d9c938f1abf06bc6138a223a0beb976baba8e22be994501cdf0c992cbbbb86
            [source] => fccid
            [url] => https://apps.fcc.gov/eas/GetApplicationAttachment.html?id=6770995
            [href_text] => Cover Letter (Description of Change)
            [href_description] => Qualcomm Technologies, Inc. QCNCM865 Qualcomm WiFi 7/BT Combo module J9C-QCNCM865 J9CQCNCM865 qcncm865
            [http_status] => 200
            [http_lastmod] => 0000-00-00 00:00:00
            [http_contenttype] => application/pdf
            [http_filename] => GetApplicationAttachment.html?id=6770995
            [http_size] => 288507
            [file_sha256] => 50c2dc7efe460d7e3990f936fb227d803e109d7bf26437f3b32397c9ef3c40bc
            [domain] => document.fccid
        )

    [2] => Array
        (
            [url_sha] => e77765b7d1d532dfe7e9d7544f72afe335bcf1cf890a9d549c9ec549bccf25a9
            [source] => fccid
            [url] => https://apps.fcc.gov/eas/GetApplicationAttachment.html?id=6771042
            [href_text] => Cover Letter (Description of Change)
            [href_description] => Qualcomm Technologies, Inc. QCNCM865  J9C-QCNCM865 J9CQCNCM865 qcncm865
            [http_status] => 200
            [http_lastmod] => 0000-00-00 00:00:00
            [http_contenttype] => application/pdf
            [http_filename] => GetApplicationAttachment.html?id=6771042
            [http_size] => 288507
            [file_sha256] => 50c2dc7efe460d7e3990f936fb227d803e109d7bf26437f3b32397c9ef3c40bc
            [domain] => document.fccid
        )

)
Array
(
    [0] => Array
        (
            [id] => 6770839
            [file_sha256] => 
            [applicationId] => /RFqcZfoDS+90/bi3E0p2g==
            [description] => Cover Letter (Description of Change)
            [shortTermConfidential] => No
            [permanentConfidential] => No
            [supercede] => No
            [exhibitType] => Cover Letter(s)
            [fileType] => Adobe Acrobat PDF
            [displayType] => pdf
            [fileSize] => 288508
            [submissionDate] => 2023-08-31 00:00:00
            [dateAvailable] => 2023-09-12 00:00:00
            [creationDate] => 
            [producer] => 
            [modDate] => 
            [title] => 
            [creator] => 
            [author] => 
            [pages] => 
            [realSize] => 
            [html] => 0
            [png] => 0
            [txt] => 0
            [version] => 0
            [source] => 0
            [fccId] => J9C-QCNCM865
            [cleanFccId] => J9CQCNCM865
            [exif] => 0
        )

)