This document presents a comprehensive visual examination of the Equipment Under Test (EUT) through a series of internal photographs. The images provide a detailed view of the device's internal components, including the housing, main board, and various solder points. The purpose of these photographs is to document the construction and layout of the EUT for testing and certification purposes.
The photographs showcase the arrangement of components on the board, highlighting the placement of key elements such as the antenna and integrated circuits. Close-up shots of solder points offer insights into the manufacturing quality and assembly techniques employed. The images are accompanied by reference numbers and scale measurements to facilitate accurate analysis and comparison.
This visual documentation serves as a valuable resource for engineers and technicians involved in the testing, evaluation, and potential modification of the EUT. The detailed imagery allows for a thorough understanding of the device's internal architecture and component placement.
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This document presents a comprehensive visual examination of the Equipment Under Test (EUT) through a series of internal photographs. The images provide a detailed view of the device's internal components, including the housing, main board, and various solder points. The purpose of these photographs is to document the construction and layout of the EUT for testing and certification purposes.
The photographs showcase the arrangement of components on the board, highlighting the placement of key elements such as the antenna and integrated circuits. Close-up shots of solder points offer insights into the manufacturing quality and assembly techniques employed. The images are accompanied by reference numbers and scale measurements to facilitate accurate analysis and comparison.
This visual documentation serves as a valuable resource for engineers and technicians involved in the testing, evaluation, and potential modification of the EUT. The detailed imagery allows for a thorough understanding of the device's internal architecture and component placement.
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