labe and Label location

File Info : application/pdf, 1 Pages, 124.02KB

Array
(
    [0] => Array
        (
            [url_sha] => eec69be963ec49235ec3f183566c679d4ff8acad05f7d2b83766043084006754
            [source] => fccid
            [url] => https://apps.fcc.gov/eas/GetApplicationAttachment.html?id=5826143
            [href_text] => labe and Label location
            [href_description] => Shenzhen Hismith Technology Co., Ltd HS18  2A4T3-HS18 2A4T3HS18 hs18
            [http_status] => 200
            [http_lastmod] => 0000-00-00 00:00:00
            [http_contenttype] => application/pdf
            [http_filename] => GetApplicationAttachment.html?id=5826143
            [http_size] => 127000
            [file_sha256] => 4f35761a04a885307f08b658cf0ec3e0885125c8ae79642d90bb7c668a12b527
            [domain] => document.fccid
        )

)

Array
(
    [0] => Array
        (
            [id] => 5826143
            [file_sha256] => 
            [applicationId] => 4+/H34qxHtlj4PFzMrj4WA==
            [description] => labe and Label location
            [shortTermConfidential] => No
            [permanentConfidential] => No
            [supercede] => No
            [exhibitType] => ID Label/Location Info
            [fileType] => Adobe Acrobat PDF
            [displayType] => pdf
            [fileSize] => 127001
            [submissionDate] => 2022-04-18 00:00:00
            [dateAvailable] => 2022-04-18 00:00:00
            [creationDate] => 
            [producer] => 
            [modDate] => 
            [title] => 
            [creator] => 
            [author] => 
            [pages] => 
            [realSize] => 
            [html] => 0
            [png] => 0
            [txt] => 0
            [version] => 0
            [source] => 0
            [fccId] => 2A4T3-HS18
            [cleanFccId] => 2A4T3HS18
            [exif] => 0
        )

)