Cover Letter (Agent Authorization).pdf

File Info : application/pdf, 1 Pages, 82.38KB

Array
(
    [0] => Array
        (
            [url_sha] => fab49e5733925d2d7483a3d5f5e5cf0a634aba1e7c130e06a44624b725e88fad
            [source] => fccid
            [url] => https://apps.fcc.gov/eas/GetApplicationAttachment.html?id=4045096
            [href_text] => Cover Letter (Agent Authorization).pdf
            [href_description] => Microelectronics Technology Inc RU00-M03 RFID HP-SIP Module MAD-RU00-M03 MADRU00M03 ru00 m03
            [http_status] => 200
            [http_lastmod] => 0000-00-00 00:00:00
            [http_contenttype] => application/pdf
            [http_filename] => GetApplicationAttachment.html?id=4045096
            [http_size] => 84356
            [file_sha256] => 4dc526308fe4481f7b9f63dc44d07ddeeb9497599dd3b4e5e8b21f09f429bf9a
            [domain] => document.fccid
        )

)

Array
(
    [0] => Array
        (
            [id] => 4045096
            [file_sha256] => 
            [applicationId] => 9flePP/6tmxk755JTh3ZEA==
            [description] => Cover Letter (Agent Authorization).pdf
            [shortTermConfidential] => No
            [permanentConfidential] => No
            [supercede] => No
            [exhibitType] => Cover Letter(s)
            [fileType] => Adobe Acrobat PDF
            [displayType] => pdf
            [fileSize] => 84358
            [submissionDate] => 2018-10-23 00:00:00
            [dateAvailable] => 2018-10-23 00:00:00
            [creationDate] => 
            [producer] => 
            [modDate] => 
            [title] => 
            [creator] => 
            [author] => 
            [pages] => 
            [realSize] => 
            [html] => 0
            [png] => 0
            [txt] => 0
            [version] => 0
            [source] => 0
            [fccId] => MAD-RU00-M03
            [cleanFccId] => MADRU00M03
            [exif] => 0
        )

)