Authorization letter of application

File Info : application/pdf, 1 Pages, 286.66KB

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            [url] => https://apps.fcc.gov/eas/GetApplicationAttachment.html?id=5256786
            [href_text] => Authorization letter of application
            [href_description] => Spigen Korea Co., Ltd. PF2004 Spigen PowerArc ArcField 2AFKNPF2004 2AFKNPF2004 pf2004
            [http_status] => 200
            [http_lastmod] => 0000-00-00 00:00:00
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            [applicationId] => PLnCsAF14Q5XLvR0pfi81A==
            [description] => Authorization letter of application
            [shortTermConfidential] => No
            [permanentConfidential] => No
            [supercede] => No
            [exhibitType] => Cover Letter(s)
            [fileType] => Adobe Acrobat PDF
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            [fileSize] => 293545
            [submissionDate] => 2021-05-20 00:00:00
            [dateAvailable] => 2021-05-20 00:00:00
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            [title] => 
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            [pages] => 
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            [fccId] => 2AFKNPF2004
            [cleanFccId] => 2AFKNPF2004
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