Cover Letter

File Info : application/pdf, 1 Pages, 149.74KB

Array
(
    [0] => Array
        (
            [url_sha] => a31e37ea47f88974343b85e1bc1ba23260c347dc42f0a31c894227d02761abe9
            [source] => fccid
            [url] => https://apps.fcc.gov/eas/GetApplicationAttachment.html?id=5204375
            [href_text] => Cover Letter
            [href_description] => Particle Industries, Inc. B402 Mesh and Bluetooth module 2AEMI-B402 2AEMIB402 b402
            [http_status] => 200
            [http_lastmod] => 0000-00-00 00:00:00
            [http_contenttype] => application/pdf
            [http_filename] => GetApplicationAttachment.html?id=5204375
            [http_size] => 153334
            [file_sha256] => 3e0242d6ea4c82af7fc0919094c9249b65781bad51d1567478a8ca94168c04c2
            [domain] => document.fccid
        )

)

Array
(
    [0] => Array
        (
            [id] => 5204375
            [file_sha256] => 
            [applicationId] => Tq5X2HhvQq9KTvY3Ds0P1A==
            [description] => Cover Letter
            [shortTermConfidential] => No
            [permanentConfidential] => No
            [supercede] => No
            [exhibitType] => Cover Letter(s)
            [fileType] => Adobe Acrobat PDF
            [displayType] => pdf
            [fileSize] => 153334
            [submissionDate] => 2021-04-14 00:00:00
            [dateAvailable] => 2021-04-14 00:00:00
            [creationDate] => 
            [producer] => 
            [modDate] => 
            [title] => 
            [creator] => 
            [author] => 
            [pages] => 
            [realSize] => 
            [html] => 0
            [png] => 0
            [txt] => 0
            [version] => 0
            [source] => 0
            [fccId] => 2AEMI-B402
            [cleanFccId] => 2AEMIB402
            [exif] => 0
        )

)