Cover Letter - Modular Approval Request.pdf
Acrobat Distiller 8.1.0 (Windows)
tags: Array
(
[0] => Array
(
[url_sha] => 40a8e77739ec50d03f27200b1dfb5eba3085a5698c6c99e3b02a2b5ed4bcb987
[source] => fccid
[url] => https://apps.fcc.gov/eas/GetApplicationAttachment.html?id=2599775
[href_text] => Cover Letter - Modular Approval Request.pdf
[href_description] => Microelectronics Technology Inc RU00-M03 RFID HP-SIP Module MAD-RU00-M03 MADRU00M03 ru00 m03
[http_status] => 200
[http_lastmod] => 0000-00-00 00:00:00
[http_contenttype] => application/pdf
[http_filename] => GetApplicationAttachment.html?id=2599775
[http_size] => 22292
[file_sha256] => 3b69661a33bca5edd89996c60c0689e960788d0456fd7c3b71ee770b37f9d8d9
[domain] => document.fccid
)
)
Array
(
[0] => Array
(
[id] => 2599775
[file_sha256] =>
[applicationId] => wJ02OQCgxz+XuEIURn4hNw==
[description] => Cover Letter - Modular Approval Request.pdf
[shortTermConfidential] => No
[permanentConfidential] => No
[supercede] => No
[exhibitType] => Cover Letter(s)
[fileType] => Adobe Acrobat PDF
[displayType] => pdf
[fileSize] => 22294
[submissionDate] => 2015-04-29 00:00:00
[dateAvailable] => 2015-04-29 00:00:00
[creationDate] =>
[producer] =>
[modDate] =>
[title] =>
[creator] =>
[author] =>
[pages] =>
[realSize] =>
[html] => 0
[png] => 0
[txt] => 0
[version] => 0
[source] => 0
[fccId] => MAD-RU00-M03
[cleanFccId] => MADRU00M03
[exif] => 0
)
)