YETM4D-UC_TestRpt_PCB_LTE_B7.7C.38.38C.41.41C
Microsoft Word 2013 Microsoft Word 2013
tags: Array
(
[0] => Array
(
[url_sha] => 142d943ddf9b64f805593cbc527b3e919eba283d6dddc63418afade5541d7cf1
[source] => fccid
[url] => https://apps.fcc.gov/eas/GetApplicationAttachment.html?id=8050551
[href_text] => YETM4D-UC_TestRpt_PCB_LTE_B7.7C.38.38C.41.41C
[href_description] => Nextivity Incorporated M4D-UC YETM4D-UC YETM4DUC m4d uc
[http_status] => 200
[http_lastmod] => 0000-00-00 00:00:00
[http_contenttype] => application/pdf
[http_filename] => GetApplicationAttachment.html?id=8050551
[http_size] => 1279306
[file_sha256] => 398ceb65d95dcbf95288a54c966336c35ab75a4a27d8405d0afb77530fffefb9
[domain] => document.fccid
)
)
Array
(
[0] => Array
(
[id] => 8050551
[file_sha256] =>
[applicationId] => zVP7A7j7meCNk2DzXxx4Gg==
[description] => YETM4D-UC_TestRpt_PCB_LTE_B7.7C.38.38C.41.41C
[shortTermConfidential] => No
[permanentConfidential] => No
[supercede] => No
[exhibitType] => Test Report
[fileType] => Adobe Acrobat PDF
[displayType] => pdf
[fileSize] => 1279308
[submissionDate] => 2025-02-16 00:00:00
[dateAvailable] => 2025-02-18 00:00:00
[creationDate] =>
[producer] =>
[modDate] =>
[title] =>
[creator] =>
[author] =>
[pages] =>
[realSize] =>
[html] => 0
[png] => 0
[txt] => 0
[version] => 0
[source] => 0
[fccId] => YETM4D-UC
[cleanFccId] => YETM4DUC
[exif] => 0
)
)