Cover Letter-Authorization for signing-Heejae to Sung Soo Rev01-230307

File Info : application/pdf, 1 Pages, 9.78KB

Array
(
    [0] => Array
        (
            [url_sha] => 7ef5a4801805c7c842f22ed25aed8efa0101ddd2c432d91728a25c8dc0361346
            [source] => fccid
            [url] => https://apps.fcc.gov/eas/GetApplicationAttachment.html?id=6398606
            [href_text] => Cover Letter-Authorization for signing-Heejae to Sung Soo Rev01-230307
            [href_description] => LG Electronics USA, Inc. WL1BKT23 Wireless Audio Module BEJ-WL1BKT23 BEJWL1BKT23 wl1bkt23
            [http_status] => 200
            [http_lastmod] => 0000-00-00 00:00:00
            [http_contenttype] => application/pdf
            [http_filename] => GetApplicationAttachment.html?id=6398606
            [http_size] => 10010
            [file_sha256] => 367dcd47dfc13d810ec5e9c5eadafae8ec9481d2a80f74e41444ff8f9579e9ee
            [domain] => document.fccid
        )

)

Array
(
    [0] => Array
        (
            [id] => 6398606
            [file_sha256] => 
            [applicationId] => 7Pf3WovNUHWKkrGHDnVtOQ==
            [description] => Cover Letter-Authorization for signing-Heejae to Sung Soo Rev01-230307
            [shortTermConfidential] => No
            [permanentConfidential] => No
            [supercede] => No
            [exhibitType] => Cover Letter(s)
            [fileType] => Adobe Acrobat PDF
            [displayType] => pdf
            [fileSize] => 10010
            [submissionDate] => 2023-03-08 00:00:00
            [dateAvailable] => 2023-03-09 00:00:00
            [creationDate] => 
            [producer] => 
            [modDate] => 
            [title] => 
            [creator] => 
            [author] => 
            [pages] => 
            [realSize] => 
            [html] => 0
            [png] => 0
            [txt] => 0
            [version] => 0
            [source] => 0
            [fccId] => BEJ-WL1BKT23
            [cleanFccId] => BEJWL1BKT23
            [exif] => 0
        )

)