This document presents a comprehensive internal photographic analysis of a wireless headphone device, conducted by Shenzhen DL Testing Technology Co., Ltd. The images provide a detailed view of the headphone's internal components, including the printed circuit board (PCB), battery, and speaker elements. These photos are crucial for understanding the device's construction, design, and component placement.
The PCB images reveal the intricate circuitry and component layout, highlighting the integration of various chips and connectors. The battery photo showcases its specifications, including voltage and capacity. The speaker images provide insights into its design and construction, which are critical for audio performance. The document also includes close-up shots of key components, such as the BP2077S-06F8 chip and the AC7006F chip, allowing for a detailed examination of their markings and connections.
Overall, this document serves as a valuable resource for understanding the internal workings of the wireless headphones, providing a visual representation of its design and construction.
Array
(
[0] => Array
(
[url_sha] => f2bed83a0edb02cb87035fc8f6cc50be1a60344b9cf2ac38f54b2d1666805f8c
[source] => fccid
[url] => https://apps.fcc.gov/eas/GetApplicationAttachment.html?id=8058541
[href_text] => Internal photos
[href_description] => Shenzhen Yinzhihang Technology Co., Ltd. TWS-T75 wireless earphones 2BFFW-TWS-T75 2BFFWTWST75 tws t75
[http_status] => 200
[http_lastmod] => 0000-00-00 00:00:00
[http_contenttype] => application/pdf
[http_filename] => GetApplicationAttachment.html?id=8058541
[http_size] => 1514814
[file_sha256] => 334b0fc551917c9042007213e1d19b18207c26314071ef0619231ccfe3e646e4
[domain] => document.fccid
)
)
Array
(
[file_sha256] => 334b0fc551917c9042007213e1d19b18207c26314071ef0619231ccfe3e646e4
[cleanFccId] => 2BFFWTWST75
[title] => Internal Photos of Wireless Headphones by Shenzhen DL Testing
[description] => A detailed look inside the wireless headphones, showcasing the internal components and design. Includes PCB, battery, and speaker elements.
[brand_name] => Shenzhen DL Testing Technology Co., Ltd.
[keywords] => ["Wireless Headphones", "Internal Photos", "PCB", "Battery", "Speaker", "BP2077S-06F8", "HL 803040", "AC7006F"]
[intro] =>
This document presents a comprehensive internal photographic analysis of a wireless headphone device, conducted by Shenzhen DL Testing Technology Co., Ltd. The images provide a detailed view of the headphone's internal components, including the printed circuit board (PCB), battery, and speaker elements. These photos are crucial for understanding the device's construction, design, and component placement.
The PCB images reveal the intricate circuitry and component layout, highlighting the integration of various chips and connectors. The battery photo showcases its specifications, including voltage and capacity. The speaker images provide insights into its design and construction, which are critical for audio performance. The document also includes close-up shots of key components, such as the BP2077S-06F8 chip and the AC7006F chip, allowing for a detailed examination of their markings and connections.
Overall, this document serves as a valuable resource for understanding the internal workings of the wireless headphones, providing a visual representation of its design and construction.
)
Array
(
[0] => Array
(
[id] => 8058541
[file_sha256] =>
[applicationId] => AJMQT4wTg0NcPZnB5HSw6A==
[description] => Internal photos
[shortTermConfidential] => No
[permanentConfidential] => No
[supercede] => No
[exhibitType] => Internal Photos
[fileType] => Adobe Acrobat PDF
[displayType] => pdf
[fileSize] => 1514814
[submissionDate] => 2025-02-19 00:00:00
[dateAvailable] => 2025-02-20 00:00:00
[creationDate] =>
[producer] =>
[modDate] =>
[title] =>
[creator] =>
[author] =>
[pages] =>
[realSize] =>
[html] => 0
[png] => 0
[txt] => 0
[version] => 1
[source] => 0
[fccId] => 2BFFW-TWS-T75
[cleanFccId] => 2BFFWTWST75
[exif] => 0
)
)