FCC_Modular Cover letter
Microsoft Word for Microsoft 365
tags: Array
(
[0] => Array
(
[url_sha] => 1e1b36bb57d5308ebb9255b0dbf1e507a7d5c603842afd0037eb5764fa72affb
[source] => fccid
[url] => https://apps.fcc.gov/eas/GetApplicationAttachment.html?id=7904173
[href_text] => FCC_Modular Cover letter
[href_description] => Qualcomm Technologies, Inc. QCC744M0 Tri-Radio LGA Module for IoT applications J9C-QCC744M0 J9CQCC744M0 qcc744m0
[http_status] => 200
[http_lastmod] => 0000-00-00 00:00:00
[http_contenttype] => application/pdf
[http_filename] => GetApplicationAttachment.html?id=7904173
[http_size] => 160293
[file_sha256] => 234d565efc87413c1219a6679057c91cab2163206894b7d695d11d9316e587cb
[domain] => document.fccid
)
[1] => Array
(
[url_sha] => 07d284a86469bc1186cf85f567c7886c7468257b616b19c69abfdff187fab004
[source] => fccid
[url] => https://apps.fcc.gov/eas/GetApplicationAttachment.html?id=7904101
[href_text] => FCC_Modular Cover letter
[href_description] => Qualcomm Technologies, Inc. QCC744M0 Tri-Radio LGA Module for IoT applications J9C-QCC744M0 J9CQCC744M0 qcc744m0
[http_status] => 200
[http_lastmod] => 0000-00-00 00:00:00
[http_contenttype] => application/pdf
[http_filename] => GetApplicationAttachment.html?id=7904101
[http_size] => 160293
[file_sha256] => 234d565efc87413c1219a6679057c91cab2163206894b7d695d11d9316e587cb
[domain] => document.fccid
)
)
Array
(
[0] => Array
(
[id] => 7904101
[file_sha256] =>
[applicationId] => cQeAT1MwsN4JlrfKf6wMZA==
[description] => FCC_Modular Cover letter
[shortTermConfidential] => No
[permanentConfidential] => No
[supercede] => No
[exhibitType] => Cover Letter(s)
[fileType] => Adobe Acrobat PDF
[displayType] => pdf
[fileSize] => 160293
[submissionDate] => 2024-12-16 00:00:00
[dateAvailable] => 2024-12-16 00:00:00
[creationDate] =>
[producer] =>
[modDate] =>
[title] =>
[creator] =>
[author] =>
[pages] =>
[realSize] =>
[html] => 0
[png] => 0
[txt] => 0
[version] => 0
[source] => 0
[fccId] => J9C-QCC744M0
[cleanFccId] => J9CQCC744M0
[exif] => 0
)
)