2A3ZO-EGM-S-21072_Dismissal_Letter
tags: Array
(
[0] => Array
(
[url_sha] => 335b737077e12db408a735cd4363b9a77c2d3265849ae002faf374c711c6a805
[source] => fccid
[url] => https://apps.fcc.gov/eas/GetApplicationAttachment.html?id=6307012
[href_text] => 2A3ZO-EGM-S-21072_Dismissal_Letter
[href_description] => Hong Kong Etech Groups Ltd. EGM-S-21072 2A3ZO-EGM-S-21072 2A3ZOEGMS21072 egm s 21072
[http_status] => 500
[http_lastmod] => 0000-00-00 00:00:00
[http_contenttype] => text/html;charset=iso-8859-1
[http_filename] => GetApplicationAttachment.html?id=6307012
[http_size] => 21773
[file_sha256] => 224454686f748466076050e5d4b4acb411f9ad821c662305bae42dc7edc7bea3
[domain] => document.fccid
)
)
Array
(
[0] => Array
(
[id] => 6307012
[file_sha256] =>
[applicationId] => SIIqS9EfOoP7b6y6VZPrbA==
[description] => 2A3ZO-EGM-S-21072_Dismissal_Letter
[shortTermConfidential] => No
[permanentConfidential] => No
[supercede] => No
[exhibitType] => Cover Letter(s)
[fileType] => Adobe Acrobat PDF
[displayType] => pdf
[fileSize] => 61564
[submissionDate] => 2023-01-03 00:00:00
[dateAvailable] => 2022-04-12 00:00:00
[creationDate] =>
[producer] =>
[modDate] =>
[title] =>
[creator] =>
[author] =>
[pages] =>
[realSize] =>
[html] => 0
[png] => 0
[txt] => 0
[version] => 0
[source] => 0
[fccId] => 2A3ZO-EGM-S-21072
[cleanFccId] => 2A3ZOEGMS21072
[exif] => 0
)
)