This document presents a comprehensive collection of internal component photographs, providing a detailed look at the device's construction and key elements. The report, generated by Bay Area Compliance Laboratories Corp., includes images of the main PCB, antenna modules, and various integrated circuits. Model numbers and identification codes are clearly visible, aiding in component identification and analysis.
The photographs showcase the intricate layout of the PCB, highlighting the placement of the Qualcomm QCM2150 processor, PM215 power management IC, and WCN3680B wireless connectivity module. Antenna details, including the Zigbee and WiFi/Bluetooth antennas, are also presented. This visual documentation serves as a valuable resource for understanding the device's internal architecture and component selection.
Specific components like the KMQE60013B memory chip and various other integrated circuits are clearly depicted, along with their respective markings and identifiers. The report also includes close-up shots of connectors, test points, and other critical elements of the device's internal design. This level of detail is essential for engineers and technicians involved in product development, testing, and repair.
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This document presents a comprehensive collection of internal component photographs, providing a detailed look at the device's construction and key elements. The report, generated by Bay Area Compliance Laboratories Corp., includes images of the main PCB, antenna modules, and various integrated circuits. Model numbers and identification codes are clearly visible, aiding in component identification and analysis.
The photographs showcase the intricate layout of the PCB, highlighting the placement of the Qualcomm QCM2150 processor, PM215 power management IC, and WCN3680B wireless connectivity module. Antenna details, including the Zigbee and WiFi/Bluetooth antennas, are also presented. This visual documentation serves as a valuable resource for understanding the device's internal architecture and component selection.
Specific components like the KMQE60013B memory chip and various other integrated circuits are clearly depicted, along with their respective markings and identifiers. The report also includes close-up shots of connectors, test points, and other critical elements of the device's internal design. This level of detail is essential for engineers and technicians involved in product development, testing, and repair.
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