CONF Letter

File Info : application/pdf, 1 Pages, 188.25KB

Array
(
    [0] => Array
        (
            [url_sha] => be62bec3808a0fc2416e2faebaa380eee2f563ae9fd8c9e7450110d487d2ea9a
            [source] => fccid
            [url] => https://apps.fcc.gov/eas/GetApplicationAttachment.html?id=7346899
            [href_text] => CONF Letter
            [href_description] => Shenzhen Qianyan Technology LTD H5130  2A7VD-H5130 2A7VDH5130 h5130
            [http_status] => 200
            [http_lastmod] => 0000-00-00 00:00:00
            [http_contenttype] => application/pdf
            [http_filename] => GetApplicationAttachment.html?id=7346899
            [http_size] => 192765
            [file_sha256] => 1984676db1e42db725ec153adde69c3e8586babc8ed910f757eebfec7bafa310
            [domain] => document.fccid
        )

)

Array
(
    [0] => Array
        (
            [id] => 7346899
            [file_sha256] => 
            [applicationId] => Iz2bybYg/GG4DbHgyFMWSQ==
            [description] => CONF Letter
            [shortTermConfidential] => No
            [permanentConfidential] => No
            [supercede] => No
            [exhibitType] => Cover Letter(s)
            [fileType] => Adobe Acrobat PDF
            [displayType] => pdf
            [fileSize] => 192766
            [submissionDate] => 2024-05-26 00:00:00
            [dateAvailable] => 2024-05-26 00:00:00
            [creationDate] => 
            [producer] => 
            [modDate] => 
            [title] => 
            [creator] => 
            [author] => 
            [pages] => 
            [realSize] => 
            [html] => 0
            [png] => 0
            [txt] => 0
            [version] => 0
            [source] => 0
            [fccId] => 2A7VD-H5130
            [cleanFccId] => 2A7VDH5130
            [exif] => 0
        )

)