CIIPC letter

File Info : application/pdf, 1 Pages, 151.49KB

Array
(
    [0] => Array
        (
            [url_sha] => 931d89cd20d4880040a29659b62a5444ce10c982980d66b51d399bc8227263b6
            [source] => fccid
            [url] => https://apps.fcc.gov/eas/GetApplicationAttachment.html?id=4834923
            [href_text] => CIIPC letter
            [href_description] => Microchip Technology Inc. R30M SAMR30 IEEE 802.15.4 Sub-1GHz Module 2ADHKR30M 2ADHKR30M r30m
            [http_status] => 200
            [http_lastmod] => 0000-00-00 00:00:00
            [http_contenttype] => application/pdf
            [http_filename] => GetApplicationAttachment.html?id=4834923
            [http_size] => 155129
            [file_sha256] => 13e6de02d1efa385669f65781f1a8b76dbec6d0f6f8e2490325aeda1d546f1d0
            [domain] => document.fccid
        )

)

Array
(
    [0] => Array
        (
            [id] => 4834923
            [file_sha256] => 
            [applicationId] => 37E8XsaNEG1GpFTYBMvCwg==
            [description] => CIIPC letter
            [shortTermConfidential] => No
            [permanentConfidential] => No
            [supercede] => No
            [exhibitType] => Cover Letter(s)
            [fileType] => Adobe Acrobat PDF
            [displayType] => pdf
            [fileSize] => 155131
            [submissionDate] => 2020-07-31 00:00:00
            [dateAvailable] => 2020-08-17 00:00:00
            [creationDate] => 
            [producer] => 
            [modDate] => 
            [title] => 
            [creator] => 
            [author] => 
            [pages] => 
            [realSize] => 
            [html] => 0
            [png] => 0
            [txt] => 0
            [version] => 0
            [source] => 0
            [fccId] => 2ADHKR30M
            [cleanFccId] => 2ADHKR30M
            [exif] => 0
        )

)