Authorization Letter

File Info : application/pdf, 1 Pages, 9.80KB

Array
(
    [0] => Array
        (
            [url_sha] => c4bb7f2cc12ebe3bfeb4939e86d104ed28b182c021528f8b95abe0ffc9013d3c
            [source] => fccid
            [url] => https://apps.fcc.gov/eas/GetApplicationAttachment.html?id=4236530
            [href_text] => Authorization Letter
            [href_description] => Sun Cupid Technology (HK) Ltd. N5002L LTE Mobile Phone 2ADINN5002L 2ADINN5002L n5002l
            [http_status] => 200
            [http_lastmod] => 0000-00-00 00:00:00
            [http_contenttype] => application/pdf
            [http_filename] => GetApplicationAttachment.html?id=4236530
            [http_size] => 10039
            [file_sha256] => 0b5ed9bb968a3845e0417b8e76b00386c0bf2a89b1996919abbf91f09b33d47d
            [domain] => document.fccid
        )

)

Array
(
    [0] => Array
        (
            [id] => 4236530
            [file_sha256] => 
            [applicationId] => 20tocrlqsRtOcRVx3+Ym5w==
            [description] => Authorization Letter
            [shortTermConfidential] => No
            [permanentConfidential] => No
            [supercede] => No
            [exhibitType] => Cover Letter(s)
            [fileType] => Adobe Acrobat PDF
            [displayType] => pdf
            [fileSize] => 10920
            [submissionDate] => 2019-04-11 00:00:00
            [dateAvailable] => 2019-04-11 00:00:00
            [creationDate] => 
            [producer] => 
            [modDate] => 
            [title] => 
            [creator] => 
            [author] => 
            [pages] => 
            [realSize] => 
            [html] => 0
            [png] => 0
            [txt] => 0
            [version] => 0
            [source] => 0
            [fccId] => 2ADINN5002L
            [cleanFccId] => 2ADINN5002L
            [exif] => 0
        )

)